About the role
Layout Scale-Up Engineer at Alice & Bob in Paris. Hybrid. Posted September 16, 2026.
About the Mission
Alice & Bob's current 48-qubit generation was hand-drawn — the next generations won't be. As we scale toward 1,000-, 10,000-, and eventually million-qubit chips, manual layout stops being an option: it doesn't scale, and it caps how fast we can iterate. This role exists to build the infrastructure — PDK, generators, automated flows — that lets chip complexity grow 10–1,000× while design cycle time stays flat.About the Role
You'll build the layout infrastructure that makes that scaling possible — PDK, layout compilers, parasitic extraction, hierarchical verification, and mask generation. This is a semiconductor physical-design role applied to superconducting hardware, not a quantum physics one.
Responsibilities
- Build and own the PDK — layer stack, technology file, parametric cells (junctions, CPW, resonators, couplers, pads, airbridges/crossovers) — and their DRC/LVS decks
- Design a tile-based, hierarchical layout methodology: standardized reticle-compatible tiles, programmatic instantiation, and stitching for wafer-scale and multi-chip designs
- Write and maintain layout generators (Python/GDS or vendor EDA scripting) that turn architecture spec + frequency plan into DRC-clean GDSII/OASIS with zero manual drawing
- Own mask generation end-to-end: floorplan → hierarchical layout → DRC/LVS/PEX signoff → wafer map, test structures, PCM placement → mask data prep and tape-out package
- Drive automation targets: >50% automated layout at 400 qubits, >80% at 1,000, >90% at 10,000+
- Keep DRC/LVS/PEX runtime and file size tractable at 10⁶–10⁸ elements via hierarchical, cell-level, and incremental verification
- Evaluate and deploy the EDA toolchain (Cadence/Siemens/Synopsys-class or open-source) and integrate it with EM-simulation handoff
- Serve as physical-implementation signoff at design review gates ahead of mask release
Requirements
- 5+ years in physical design, custom/analog layout, PDK development, or mask data prep in a semiconductor context (CMOS backend, RF/analog, MEMS, or photonics), including at least one production tape-out owned end-to-end
- Track record scaling a layout methodology — replacing hand-drawn layout with generators, PCells, or hierarchical flows on a design that grew substantially in element count
- Hands-on parasitic extraction experience — commercial (Calibre xRC/xACT, Quantus, StarRC) and/or field-solver-based (FastCap/FastHenry, BEM/FEM) — including deck/rule-file development and correlation against EM or measurement
- Strong layout-automation scripting: Python (gdstk/gdsfactory/KLayout API) and/or vendor languages (SKILL, Tcl)
- Fluent in DRC/LVS deck authoring, GDSII/OASIS, reticle and stepper constraints (field size, stitching, alignment marks), and tape-out data prep
- Comfortable turning a frequency plan or floorplan constraint set into geometry
- Fluent English and excellent written and verbal communication skills
- Experience with superconducting or cryogenic device layout (Nb/Ta/TiN/Al thin films, Josephson junctions, CPW resonators, airbridges) and the loss/crosstalk-driven layout rules that come with it
Nice to Have
Recruitment Process
- Screening Call with Grace, Talent Acquisition Specialist (30 min)
- Hiring Manager Interview with Felix (45 min)
- Technical Interview/Presentation with the Team (120 min)
- Leadership Team Interview (30 min)
- Fit Interview (45 min)
- Reference check
Prefer to apply yourself? Apply on Alice & Bob’s site
Quick answers
Where is this job based?
Paris. The role is hybrid.
How much experience do you need?
The posting asks for 5+ years.
How do you apply?
Apply on Alice & Bob’s site using the link on this page. With a free Jobmagic account you can see how well you fit first.
Similar jobs
Firmware Engineer
Open Vision Engineering Inc · San Francisco · On-site
$160k–$250k · 2 hours ago
Identity & Access Management Engineer
Sonar · Geneva · On-site
4 hours ago
Software Engineer I
UiPath · Bangalore · On-site
7 hours ago