About the role
Photonics Packaging Engineer at Volantis Semiconductor, Inc. in Hybrid Remote/SF Bay Area/Austin/Boston. Hybrid. Posted July 25, 2026.
What We're Looking For:
We're looking for photonics packaging engineers to contribute to, and own aspects of the A-0 and A-1 packages.
This role bridges the classically divided photonics and advanced packaging skillsets, and thus is an unique point in our team.
Ideal Background:
- Experience with integrated photonics package assemblies with multiple dies
- Experience with integrated circuit MCM assemblies with multiple heterogeneous materials, including compound semiconductors
- Understanding of photonics concepts, such as mode field diameters, mode mismatch, polarization, etc.
Nice to Have:
- Experience with large device count photonic assemblies
- Experience with clear underfill
- Experience with high density fiber attach
- Experience with large substrate size photonic MCM assemblies
- Hands-on experience with PIC design
Prefer to apply yourself? Apply on Volantis Semiconductor, Inc.’s site
Quick answers
Where is this job based?
Hybrid Remote/SF Bay Area/Austin/Boston. The role is hybrid.
How do you apply?
Apply on Volantis Semiconductor, Inc.’s site using the link on this page. With a free Jobmagic account you can see how well you fit first.
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